RAM容量 |
768 x 8 |
程序存儲器類型 |
OTP |
工作溫度 |
-40°C ~ 85°C |
核心處理器 |
HC11 |
振蕩器型 |
Internal |
周邊設(shè)備 |
POR, WDT |
數(shù)據(jù)轉(zhuǎn)換器 |
A/D 8x8b |
程序存儲器容量 |
20KB (20K x 8) |
2nd Level Interconnect |
e3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
Export Control Classification Number (US) |
EAR99 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
Material Composition Declaration (MCD) |
Download MCD Report |
Material Type |
Tested Packaged Device |
Micron Size (μm) |
1.2 |
Mounting Style |
Surface Mount |
Package Material |
Plastic |
Pin/Lead/Ball Count |
52 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Sample Exception Availability |
N |
EEPROM 大小 |
512 x 8 |
Floor Life |
168 HOURS |
Maximum Time at Peak Temperature (s) |
30 |
Minimum Package Quantity (MPQ) |
23 |
Moisture Sensitivity Level (MSL) |
3 |
MPQ Container |
TRAY |
POQ Container |
BOX |
Leadtime (weeks) |
6 |
Halogen Free |
Yes |
Number of Reflow Cycles |
3 |
REACH SVHC |
Freescale REACH Statement |
芯體尺寸 |
8-Bit |
系列 |
HC11 |
速度 |
4MHz |
輸入/輸出數(shù) |
38 |
連通性 |
SCI, SPI |
工作電壓 |
4.5 V ~ 5.5 V |
Peak Package Body Temperature (PPT)(°C) |
250 |
Package Description and Mechanical Drawing |
PLCC 52 |
Package Thickness (nominal) (mm) |
4.380 |
Device Weight (g) |
2.96255 |
Status |
Not Recommended for New Design |
Preferred Order Quantity (POQ) |
1472 |
Description |
8BIT, 20K EPROM, 768RAM, EPP |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Package Length (nominal) (mm) |
19.120 |
Package Width (nominal) (mm) |
19.120 |
Tape & Reel |
No |
Part Number |
MC68711E20CFNE4 |
Budgetary Price($US) |
10000 @ $16.27 each |