| 系列 |
HC11 |
| 核心處理器 |
HC11 |
| 芯體尺寸 |
8-Bit |
| 速度 |
3MHz |
| RAM容量 |
768 x 8 |
| 程序存儲(chǔ)器類(lèi)型 |
OTP |
| 程序存儲(chǔ)器容量 |
20KB (20K x 8) |
| EEPROM 大小 |
512 x 8 |
| 輸入/輸出數(shù) |
38 |
| 振蕩器型 |
Internal |
| 數(shù)據(jù)轉(zhuǎn)換器 |
A/D 8x8b |
| 連通性 |
SCI, SPI |
| 工作電壓 |
4.5 V ~ 5.5 V |
| 工作溫度 |
-40°C ~ 85°C |
| 周邊設(shè)備 |
POR, WDT |
| Part Number |
MC68711E20CFUE3 |
| Export Control Classification Number (US) |
EAR99 |
| MPQ Container |
TRAY |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Status |
Not Recommended for New Design |
| 2nd Level Interconnect |
e3 |
| Material Type |
Tested Packaged Device |
| Minimum Package Quantity (MPQ) |
84 |
| Package Thickness (nominal) (mm) |
2.450 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Preferred Order Quantity (POQ) |
840 |
| Moisture Sensitivity Level (MSL) |
3 |
| Description |
8BIT, 20K EPROM, 768RAM EPP |
| Device Weight (g) |
.91160 |
| Floor Life |
168 HOURS |
| Number of Reflow Cycles |
3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
| Halogen Free |
Yes |
| Micron Size (μm) |
1.2 |
| Package Description and Mechanical Drawing |
QFP 64 14*14*2.2P0.8 |
| Package Length (nominal) (mm) |
14.000 |
| Package Width (nominal) (mm) |
14.000 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Mounting Style |
Surface Mount |
| POQ Container |
BRICK |
| Sample Exception Availability |
N |
| Budgetary Price($US) |
- |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Pin/Lead/Ball Count |
64 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Leadtime (weeks) |
20 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Maximum Time at Peak Temperature (s) |
40 |
| Package Material |
Plastic |
| REACH SVHC |
Freescale REACH Statement |