Ambient Operating Temperature (Min-Max) (°C) |
-40 to 125 |
Data Rate (Max) (kbps) |
20 |
Export Control Classification Number (US) |
EAR99 |
Floor Life |
168 HOURS |
Harmonized Tariff (US) Disclaimer |
8542.39.0000 |
Life Cycle Description (code) |
PRODUCT NEWLY INTRO D/RAMP-UP |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
.65 |
Minimum Package Quantity (MPQ) |
42 |
Moisture Sensitivity Level (MSL) |
3 |
MPQ Container |
RAIL |
Pin/Lead/Ball Count |
32 |
Regulator - Output Current (A) |
0.05 / 0.05 / 0.05 |
Sample Exception Availability |
Y |
Supply Voltage (Min-Max) (V) |
5.5 to 27 |
Num. of Linear/LDO Regulators |
3 |
POQ Container |
BOX |
Data Rate (Min) (kbps) |
10 |
Data Rate (Spec) (kbps) |
100 |
2nd Level Interconnect |
e3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
Diagnostics |
SPI |
Halogen Free |
Yes |
Interface and Input Control |
SPI |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
Mounting Style |
Surface Mount |
Number of Reflow Cycles |
3 |
Number of Regulators-Buck Switching |
0 |
Package Material |
Plastic |
REACH SVHC |
Freescale REACH Statement |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Additional Features - Power Management |
Watchdog / Stop Mode / Sleep Mode / Reset / Interrupt Output / 2 Programmable Wakeups |
Regulator - Output Voltage |
5.0 / 5.0 / 5.0 |
Additional Features-Analog |
Wake / Sleep Mode / Inhibit / Enable Input / Enable |
Part Number |
MC33689DPEW |
Package Length (nominal) (mm) |
7.500 |
Description |
System basis chip w/LIN |
Device Production Availability |
22 Jun 2012 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Preferred Order Quantity (POQ) |
3360 |
Budgetary Price($US) |
10000 @ $1.38 each |
Device Function |
Comm Transceivers / Linear Regulators / System Basis Chip |
Device Weight (g) |
.51110 |
Tape & Reel |
No |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Package Thickness (nominal) (mm) |
2.650 |
Protection |
Undervoltage / Over Temperature / Over Current Protected Bus |
Device Sample Availability |
01 May 2012 |
Status |
Active |
Communication Protocol |
LIN |
Package Description and Mechanical Drawing |
SOIC 32 300ML |
Package Width (nominal) (mm) |
11.000 |