| 2nd Level Interconnect |
e4 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
5A991 |
| Frequency Band (Min-Max) (MHz) |
2400 to 2500 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Leadtime (weeks) |
12 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Maximum Time at Peak Temperature (s) |
30 |
| Micron Size (μm) |
.25 |
| Minimum Package Quantity (MPQ) |
260 |
| MPQ Container |
TRAY |
| Pin/Lead/Ball Count |
71 |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Sample Exception Availability |
Y |
| Sensitivity at 1% PER (Typ) (dBm) |
-92 |
| Supply Voltage (Min-Max) (V) |
2 to 3.4 |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
| Internal Flash (kByte) |
60 |
| Internal RAM (kByte) |
4 |
| POQ Container |
BRICK |
| A/D Converter - Bits (bit) |
10 |
| A/D Converter - Channels |
8 |
| Data Rate (Spec) (kbps) |
250 |
| Floor Life |
168 HOURS |
| Halogen Free |
Yes |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Material Type |
Tested Packaged Device |
| Moisture Sensitivity Level (MSL) |
3 |
| Mounting Style |
Surface Mount |
| Number of Reflow Cycles |
3 |
| Package Material |
Plastic |
| REACH SVHC |
Freescale REACH Statement |
| Package Thickness (nominal) (mm) |
1.000 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Preferred Order Quantity (POQ) |
1300 |
| Part Number |
MC13213 |
| Status |
Active |
| Communication Protocol |
IEEE 802.15.4 / PROPRIETARY / ZigBee |
| Description |
SIP 802.15.4 2.4GHZ 60KB |
| Application |
2.4 GHz ISM / 802.15.4 / ZigBee |
| Peak Package Body Temperature (PPT)(°C) |
250 |
| Budgetary Price($US) |
1000 @ $3.52 each |
| Package Length (nominal) (mm) |
9.000 |
| Package Width (nominal) (mm) |
9.000 |
| Package Description and Mechanical Drawing |
LGA 71 9SQ*1.0 |
| Device Weight (g) |
.15990 |
| Tape & Reel |
No |
| Device Sample Availability |
11 May 2006 |
| Device Production Availability |
11 May 2006 |