2nd Level Interconnect |
e3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Class |
AB |
Die Technology |
LDMOS |
Export Control Classification Number (US) |
EAR99 |
Frequency (Max) (MHz) |
520 |
Frequency Band (Min-Max) (MHz) |
400 to 520 |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
1 |
Pin/Lead/Ball Count |
7 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Sample Exception Availability |
Y |
Supply Voltage (Typ) (V) |
12.5 |
Minimum Package Quantity (MPQ) |
500 |
POQ Container |
BOX |
Floor Life |
168 HOURS |
Matching |
Unmatched |
Moisture Sensitivity Level (MSL) |
3 |
P1dB (Typ) (W) |
35 |
Test Signal |
1-Tone |
Leadtime (weeks) |
8 |
Package Material |
Plastic |
Mounting Style |
Surface Mount |
Wideband Efficiency (Typ) (%) |
50 |
Wideband Frequency (Min-Max) (MHz) (f) |
400 to 520 |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
REACH SVHC |
Freescale REACH Statement |
RoHS technical exemption(s) |
7a |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Description |
RF LDMOS FET TO-272N |
Package Width (nominal) (mm) |
6.350 |
Preferred Order Quantity (POQ) |
500 |
Thermal Resistance (Spec) (°CW) |
0.9 |
Budgetary Price($US) |
- |
Status |
Active |
Tape & Reel |
Yes |
Part Number |
MRF1535NT1 |
Device Weight (g) |
1.27925 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Package Length (nominal) (mm) |
23.620 |
Package Thickness (nominal) (mm) |
2.620 |
Package Description and Mechanical Drawing |
TO-272-6 WRAP |
Pb-Free |
No |
Efficiency (Typ) (%) |
55 |
Power Gain (Typ) (dB) @ f (MHz) |
13.5 @ 520 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
35 @ CW |
Device Sample Availability |
18 Dec 2004 |
Device Production Availability |
18 Dec 2004 |