2nd Level Interconnect |
e3 |
3rd Order Intercept (Typ) (dBm) |
42 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Die Technology |
E-pHEMT |
Export Control Classification Number (US) |
5A991 |
Floor Life |
UNLIMITED |
Frequency (Max) (MHz) |
2700 |
Frequency Band (Min-Max) (MHz) |
1500 to 2700 |
Harmonized Tariff (US) Disclaimer |
8542.33.0000 |
Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
2 |
Minimum Package Quantity (MPQ) |
1000 |
Moisture Sensitivity Level (MSL) |
1 |
Noise Figure (Typ) (dB) @ f (MHz) |
1.7 @ 2140 |
P1dB (Typ) (dBm) |
27.5 |
Pin/Lead/Ball Count |
12 |
POQ Container |
REEL |
RoHS Certificate of Analysis (CoA) |
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Sample Exception Availability |
Y |
Supply Current (Typ) (mA) |
180 |
Supply Voltage (Typ) (V) |
5 |
Output Power (Typ) (dBm) @ f (MHz) |
27.5 @ 2140 |
Leadtime (weeks) |
8 |
Gain (Typ) (dB) @ f (MHz) |
16 @ 2140 |
Input 3rd Order Intercept (Typ) (dBm) @ f (MHz) |
26 @ 2140 |
Output Intercept Point (Typ) (dBm) @ f (MHz) |
42 @ 2140 |
Class |
A |
Halogen Free |
Yes |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
REACH SVHC |
Freescale REACH Statement |
Tape & Reel |
Yes |
Budgetary Price($US) |
5000 @ $1.67 each |
Package Thickness (nominal) (mm) |
.000 |
Package Length (nominal) (mm) |
.000 |
Preferred Order Quantity (POQ) |
1000 |
Device Weight (g) |
.02200 |
Package Description and Mechanical Drawing |
QFN 12EP 3SQ*.85PO0.50 |
Power Gain (Typ) (dB) @ f (MHz) |
16 @ 2140 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Package Width (nominal) (mm) |
.000 |
Status |
Active |
Part Number |
MMG20271HT1 |
Description |
27dBm GaAs Amp QFN3X3-12 |
Application |
Cellular / PCS / LTE / WLAN / TD-SCDMA |
Thermal Resistance (Spec) (°CW) |
38 |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |