2nd Level Interconnect |
e3 |
3rd Order Intercept (Typ) (dBm) |
49 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Die Technology |
InGaP HBT |
Export Control Classification Number (US) |
5A991 |
Floor Life |
UNLIMITED |
Frequency (Max) (MHz) |
2400 |
Frequency Band (Min-Max) (MHz) |
400 to 2400 |
Harmonized Tariff (US) Disclaimer |
8542.33.0000 |
Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
2 |
Minimum Package Quantity (MPQ) |
1000 |
Moisture Sensitivity Level (MSL) |
1 |
Noise Figure (Typ) (dB) @ f (MHz) |
6.6 @ 900 |
P1dB (Typ) (dBm) |
33 |
Pin/Lead/Ball Count |
16 |
POQ Container |
BOX |
RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
Sample Exception Availability |
Y |
Supply Current (Typ) (mA) |
850 |
Supply Voltage (Typ) (V) |
5 |
Output Power (Typ) (dBm) @ f (MHz) |
33 @ 900 |
Leadtime (weeks) |
8 |
Class |
A |
Halogen Free |
Yes |
Matching |
I/O |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
REACH SVHC |
Freescale REACH Statement |
Tape & Reel |
Yes |
Budgetary Price($US) |
5000 @ $2.64 each |
Package Thickness (nominal) (mm) |
.850 |
Package Length (nominal) (mm) |
4.000 |
Preferred Order Quantity (POQ) |
5000 |
Device Weight (g) |
.04110 |
Package Description and Mechanical Drawing |
QFN 16 4*4*.9.P0.65 |
Power Gain (Typ) (dB) @ f (MHz) |
17.5 @ 900 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Package Width (nominal) (mm) |
4.000 |
Status |
Active |
Part Number |
MMG3006NT1 |
Description |
33DBM GPA QFN4X4-16 |
Thermal Resistance (Spec) (°CW) |
7.8 |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |