2nd Level Interconnect |
e3 |
3rd Order Intercept (Typ) (dBm) |
30 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Die Technology |
InGaP HBT |
Export Control Classification Number (US) |
EAR99 |
Floor Life |
UNLIMITED |
Frequency (Max) (MHz) |
6000 |
Frequency Band (Min-Max) (MHz) |
0 to 6000 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
Material Composition Declaration (MCD) |
Download MCD Report |
Micron Size (μm) |
1 |
Minimum Package Quantity (MPQ) |
1000 |
Moisture Sensitivity Level (MSL) |
1 |
Noise Figure (Typ) (dB) @ f (MHz) |
3.8 @ 900 |
P1dB (Typ) (dBm) |
16 |
Pin/Lead/Ball Count |
4 |
POQ Container |
BOX |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Sample Exception Availability |
N |
Supply Current (Typ) (mA) |
47 |
Supply Voltage (Typ) (V) |
5 |
Output Power (Typ) (dBm) @ f (MHz) |
16 @ 900 |
Leadtime (weeks) |
8 |
Class |
A |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
Mounting Style |
Surface Mount |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
Package Material |
Plastic |
REACH SVHC |
Freescale REACH Statement |
Tape & Reel |
Yes |
Budgetary Price($US) |
5000 @ $0.55 each |
Package Thickness (nominal) (mm) |
1.500 |
Package Length (nominal) (mm) |
4.500 |
Preferred Order Quantity (POQ) |
8000 |
Device Weight (g) |
.05080 |
Package Description and Mechanical Drawing |
SOT-89 4.5*2.5*1.55P1.5 |
Power Gain (Typ) (dB) @ f (MHz) |
19 @ 900 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Package Width (nominal) (mm) |
2.500 |
Device Sample Availability |
09 May 2005 |
Status |
Active |
Part Number |
MMG3007NT1 |
Description |
15DBM 20DBGAIN GPA SOT89 |
Device Production Availability |
09 May 2005 |
Thermal Resistance (Spec) (°CW) |
77 |