| 2nd Level Interconnect |
e3 |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 125 |
| Diagnostics |
SPI |
| Harmonized Tariff (US) Disclaimer |
8542.39.0000 |
| Interface and Input Control |
SPI |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Load Supply Voltage (Max) (V) |
26 |
| Load Supply Voltage (Min) (V) |
5.5 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
40 |
| Micron Size (μm) |
.65 |
| Minimum Package Quantity (MPQ) |
42 |
| MPQ Container |
RAIL |
| Pin/Lead/Ball Count |
32 |
| POQ Container |
BOX |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Sample Exception Availability |
Y |
| Supply Voltage (Min-Max) (V) |
3.1 to 5.25 |
| Mounting Style |
Surface Mount |
| Package Material |
Plastic |
| Leadtime (weeks) |
15 |
| Switch Monitoring Voltage (Min-Max) (V) (VSENSE) |
-14 to 40 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
| Export Control Classification Number (US) |
EAR99 |
| Floor Life |
168 HOURS |
| Halogen Free |
Yes |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| Package Description and Mechanical Drawing |
SOIC 32 300ML |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Device Function |
Signal Conditioning |
| Package Thickness (nominal) (mm) |
2.650 |
| Package Width (nominal) (mm) |
11.000 |
| Protection |
N/A |
| Budgetary Price($US) |
10000 @ $1.36 each |
| Package Length (nominal) (mm) |
7.500 |
| Device Weight (g) |
.51000 |
| Preferred Order Quantity (POQ) |
3360 |
| Status |
Active |
| Additional Features-Analog |
Pulse wetting current |
| Tape & Reel |
No |
| Description |
MULT SW DET SUP-WKUP |
| Part Number |
MC33972ATEW |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Device Production Availability |
21 Feb 2011 |
| Device Sample Availability |
07 Sep 2010 |